SIP Combinations in Payton ● SIP USB/uSIP USB
Flash + Controller + SMT components
Flash Die: 64Gb, 128Gb
● MCP (Multi-chip Package)
Low Power DDR + Flash
DRAM Die: 2Gb, 4Gb
Flash Die: 32Gb, 64Gb
● eMMC (embedded Multi-Media Card）
Flash + Controller + SMT components
Flash Die: 64Gb
● eMCP (embedded Multi Chip Package)
Low Power DDR + Flash + Controller + SMT Components
DRAM Die: 2Gb, 4Gb
Flash Die: 32Gb, 64Gb
PCBA Vs SIP
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| Finger Printer Module | SIP-eMCP | |||||||||||||||||||||||||||||
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| SSD Module | SIP-USB |
Lab FA Capability
| Equipment | MFG | Model | Set QTY | Capability | |
| 1 | SEM | HITA CHI | S-3000N | 1 | 35x ~ 300000x(SPEC) |
| 2 | EDX | HORJBA | EX-250-X-Stream | 1 | B(5) ~ U(92) |
| 3 | SAT | SONIX | FUSION | 1 | 35MHz, 50MHz, 75MHz(A,B,C,T scan) |
| 4 | Optical Microscope | NIKON | L200 | 1 | 50x ~ 1000x with Digital Camera |
| 5 | Tooling scope | NIKON | MM-800 | 1 | 50x ~ 1000x / Precision 0.1mm |
| Equipment | MFG | Model | Set QTY | Capability | |
| 6 | Solid scope | NIKON | SMZ800 | 1 | 10x ~ 63x with CCD + Thermal printer |
| 7 | Decap Machine | NISENE | JE500 | 1 | HNO3, H2SO4, Mix Acid |
| 8 | Cross Section | BUEHLER | ECOMET 3 | 1 | 10RPM ~ 440RPM |
| 9 | Saw Machine | BUEHLER | ISOMET 1000 | 1 | 100RPM ~ 975RPM / Resolution: 0.1mm |
| 10 | Auto Curve Tracer | ISTI | Smart-01 | 1 | 200mV ~ 200V / 1uA ~ 100mA 0 |
Lab Reliability Capability
| Equipment | MFG | Model | Set QTY | Capability | |
| 11 | THB / THT | ESPEC | PR-2KP | 2 | -20C ~ +100C(+/-0.3C) / 20% ~ 98%RH(+/-2.5%RH) |
| 12 | HTST | ESPEC | PV-211 | 2 | Room Temp. ~ +200C with N2 |
| 13 | HAST / PCT (2 chambers) | ESPEC | EHS-221MD | 1 | +105C ~ 124.9C(+/-0.5C) / 75%RH ~ 100%RH(+/-3%RH) |
| 14 | TCT(Air) | ESPEC | TSA-71H-W | 1 | +60C ~ 200C / -70C ~ 0C(+/-0.5C) |
| 15 | Re-Flow | TANGTECH | SMD-10-M8HA | 1 | Room Temp. ~ 360C(4 Zone) |
